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0.01mm Ultra Fine Palladium Plated Copper Wire Flexible Solution for High Density Circuit Board Interconnects

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0.01mm Ultra Fine Palladium Plated Copper Wire Flexible Solution for High Density Circuit Board Interconnects

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Brand Name : WINNER

Model Number : PW-22

Certification : ISO9100

Place of Origin : CHINA

MOQ : 1PC

Price : 999

Payment Terms : L/C, Western Union, T/T Supply Ability

Supply Ability : 100000 rolls per month

Delivery Time : 5-8 WORKING DAYS

Packaging Details : Roll, Neutrial Packing or with OEM LOGO

Coating : Gold

Color : Silver

Wire Diameter : 0.001 inches

Flexibility : Good

Surface Finish : Bright

Tensile Strength : Strong

Applications : Electronics, Automotive, Aerospace

Purity : 99.999%

Product Type : Bonding Wire

Coating Thickness : 0.001mm

Material : Copper

Length Meters : 500/1000

Corrosion Resistance : High

Bonding Method : Ultrasonic

Temperature Range : -40°C to 200°C

Conductivity : 98%

Package Size : 100 meters

Bond Strength : High

Package : Spool

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0.01mm Ultra Fine Palladium Plated Copper Wire Flexible Solution for High Density

Circuit Board Interconnects

Discover our 0.01mm ultra fine palladium plated copper wire, a revolutionary solution for high density circuit board interconnects. Its ultra - fine diameter allows for maximum packing density on circuit boards, enabling more components to be integrated into a limited space.
The palladium plating offers excellent corrosion resistance, which extends the wire's lifespan and ensures stable performance over time. What truly sets it apart is its flexibility. This wire can be easily bent and shaped during the assembly process, adapting to complex circuit layouts without breaking.
Whether used in consumer electronics or advanced industrial equipment, it provides reliable electrical connections, making it an ideal choice for high - density circuit board applications.
Palladium-Coated Copper (PCC) bonding wire was developed and has now become the most dominant bonding material used in fine wires of diameters of <50 microns being used as substitute for more expensive gold. Thermosonic wire bonding is the most popular form of interconnection for most semiconductors. It requires the creation of a molten Free-Air Ball (FAB) at the end of the wire that is then ultrasonically-pressed on semiconductor bonding pads to form the first bond
Features:
* Gold-plated/palladium bonding wire made of 4N high-purity copper material with a certain proportion of trace elements added;
* In addition to the characteristics of conventional copper wire, it also has high strength,low curvature, high toughness, and anti-oxidation
* Chemical characteristics, the arc isimpact-resistant and the welding wire is corrosion-resistant;
* Surface gold/palladium special bonding wire developed for IC packaging;

What Is Palladium Coated Copper Bonding Wire?
Palladium Coated Copper Bonding Wire is easier to bond than your standard bare copper wire. The Palladium (Pd) coating allows for high performance and stable bonding, all within a wider bonding. The Pd coating controls the oxidation build up that can occur on the surface of the copper wire.

Pd Coated Copper Wire

Type

Ø Diameter

±1% μm

Breaking Load

BL(gf)

Elongation

EL(%)

Length

Meters

PW-1

18(0.7mil)

>4

8-14

500/1000/2000

20(0.8mil)

>5

9-15

500/1000/2000

23(0.9mil)

>7

10-17

500/1000/2000

25(1.0mil)

>9

11-17

500/1000/2000

30(1.2mil)

>14

14-22

500/1000/2000

Note: The above Diameter parameters can be customized according to customer requirements.

Application:
Applications of palladium-plated copper wire: Can be used in integrated circuits, semiconductor packaging, LED packaging, optoelectronic packaging, etc.
Advantages:

Good Conductivity & Thermal Conductivity:

Copper has excellent electrical and thermal conductivity. The palladium plating doesn't much affect these. It transmits current and heat well for electronic signal and heat dissipation, ensuring component operation.

Strong Oxidation Resistance:

Palladium is a stable precious metal. The palladium layer on the wire surface stops copper core contact with air and moisture, preventing oxidation, prolonging wire life and enhancing device reliability.

Higher Hardness:

Palladium plated copper wire is harder than pure copper. It keeps shape and stability during wire bonding, reducing contact issues from deformation. But watch for cratering in wire bonding.

0.01mm Ultra Fine Palladium Plated Copper Wire Flexible Solution for High Density Circuit Board Interconnects

1.What kind of Enameled copper wire do Winner produce?

We focus on research and development of selfbonding magnet round copper wire, fine polyurethane magnet wire, selfbonding litz copper wire and selfbonding silk covered wire.

2.What's diameters available of the Enamelled copper wire ?

We specialize in fine and ultra fine enamelled copper wire,diameters available of our products is Φ0.018-0.50mm.

3.What's selfbonding enameled copper wire?

Selfbonding enamelled copper wire is a special type of enamelled wire with an additional adhesive enamel overcoat such as thermoplastic resin.This adhesive has a bonding feature, which is activated

by heat or solvents.

Once activated the adhesive bonds turn to turn windings into a compact self supporting coil.

The use of selfbonding wire may offer cost and manufacturing advantages in some winding applications

as bobbins, tape, varnishing, or impregnation may be eliminated.

4. Is possible to get any sample of selfbonding enamelled copper wire that you have in production?

Of course you can!

0.01mm Ultra Fine Palladium Plated Copper Wire Flexible Solution for High Density Circuit Board Interconnects

0.01mm Ultra Fine Palladium Plated Copper Wire Flexible Solution for High Density Circuit Board Interconnects

0.01mm Ultra Fine Palladium Plated Copper Wire Flexible Solution for High Density Circuit Board Interconnects


Product Tags:

0.01mm Palladium Plated Copper Wire

      

Flexible Palladium Plated Copper Wire

      

Ultra Fine pd coated cu wire

      
Quality 0.01mm Ultra Fine Palladium Plated Copper Wire Flexible Solution for High Density Circuit Board Interconnects for sale

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